Process of manufacturing an optoelectronic semiconductor device

摘要

The method involves fabricating a housing (5) with a base body (6). Two holes are made in the housing, with the cross-sections matched to two conductive feedthroughs (3,4). The holes are filled with the feedthroughs or leads to the feedthroughs, and the holes are sealed. The filling process involves inserting massive pins (3,4). <??>An Independent claim is also included for semiconductor device with LED chip (2) attached.