| 摘要 |
<p>A laminate of a heat resistant film and a metal foil comprises the heat resistant film and the metal foil laminated on each other via a layer of a cured product of a terminal-modified oligomer, and has the metal foil on one surface or both surfaces thereof. In the laminate, the cured product of the terminal-modified oligomer is a heating reaction product of a terminal-modified oligomer produced by simultaneously or sequentially reacting a tetracarboxylic acid dianhydride with a diamine at a molar ratio of n:(n+1) (n is a number of 2 to 6) and with a carboxylic acid compound having an unsaturated group. The laminate can be produced readily, has excellent adhesion properties, and has excellent solder heat resistance and excellent heat resistance so as to be impervious to a high-temperature process for chip interconnection.</p> |
