| 摘要 |
This invention provides a plating apparatus which can apply at a high speed a magnetic alloy plating having a uniform thickness and a homogeneous composition on the surface of a shaft-shaped member. A plating apparatus (1) has a plating bath (3) for storing a plating liquid (2) and plates a shaft-shaped member (5), immersed in the plating liquid, with a magnetic alloy using the shaft-shaped member (5) as a cathode. The plating apparatus (1) comprise rotating means (6) for rotating the shaft-shaped member (5) as a rotating shaft, annular shielding jigs (13, 14, 15) mounted on the outer peripheral face of the shaft-shaped member (5), a plating liquid jetting nozzle (11) having a plating liquid jetting port (27) disposed so as to face the shaft-shaped member (5) while avoiding the annular shielding jigs (13, 14, 15), and an anode (10) provided around the shaft-shaped member (5) and the plating liquid jetting nozzle (9). |
