发明名称 |
Method of manufacturing printed circuit board and printed circuit board manufactured by the same |
摘要 |
A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form a window for a chip to be mounted therein and partially exposing the interconnection pattern to form a bonding finger; forming a first insulating layer on the metal layer by primarily anodizing the metal layer; electroplating a surface of the bonding finger by supplying power to the metal layer; and forming a second insulating layer disposed below the first insulating layer by entirely and secondarily anodizing the metal layer. A gold electroplating process can be performed without a lead wire, and an oxide layer formed by an anodizing process can protect circuits formed on the substrate and electrically insulate them.
|
申请公布号 |
US2009107699(A1) |
申请公布日期 |
2009.04.30 |
申请号 |
US20080288740 |
申请日期 |
2008.10.23 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
RYU JAE-CHUL |
分类号 |
H05K1/00;H05K3/10 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|