| 摘要 |
<p>A semiconductor wafer is provided to increase the contact area of a connection pad by expanding arrangement of the connection pad from the edge of the semiconductor to a scribe line. A semiconductor wafer comprises a plurality of semiconductor chips(200), a scribe line(300), and a touch pad(400). The semiconductor chips are separated from each other, and a scribe line is formed between the semiconductor chips by a certain space. Connection pad are arranged through the edge area of the semiconductor chip and the region of the scribe line to connect the circuit with the outside.</p> |
