Thermal dissipating device

摘要

An exemplary thermal dissipating device is for cooling an electronic component of a circuit board (10). The thermal dissipating device includes a heat conductive plate (20) with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat conductive plate includes a first part (22) with the first side in closely contact with the electronic component, and a second part (24) perpendicularly disposed beside the first part. The heat pipes are embedded in the second side of the conductive plate, extending from the first part to the second part. One of the fin arrays is attached to the second side of the first part of the conductive plate. The others of the fin arrays are attached to the second part of the conductive plate the first and second sides respectively.