| 摘要 |
A processing device of a shower head hole for semiconductor wafer deposition equipments is provided to manufacturing a large wafer shower head by using a slurry abrasive and ultrasonic oscillator. A body frame(100) comprises a slant supporter(110) and a slope task bracket(130). A supersonic vibration processing unit(200) is movable along the slant support, and the supersonic vibration processing unit processes an object with the supersonic vibration. A processing pressure controller(300) controls working pressure of the supersonic vibration processing unit. A slurry abrasive supply unit(400) supplies a mixed slurry to the processed object(500).
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