发明名称 DROP AMPLIFIER HOUSING WITH MULTIPLE TIERS
摘要 An amplifier housing assembly is disclosed. The housing assembly includes a first section including a first plurality of holes; and a second section including a second plurality of holes. The first and second sections are interconnected. The first and second sections have a common back wall and a common bottom plate. The first plurality of holes and the second plurality of holes are at two different parallel planes.</SDO AB>
申请公布号 CA2404839(C) 申请公布日期 2009.04.28
申请号 CA20022404839 申请日期 2002.09.24
申请人 PCI TECHNOLOGIES, INC. 发明人 LEE, JAY;NEWELL, BEN
分类号 H05K7/20;H04N5/64;H05K5/02 主分类号 H05K7/20
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