发明名称 |
Manufacturing method of a multi-layer circuit board embedded with a passive component |
摘要 |
A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points; connecting a passive element to the corresponding metal protruding points; providing a board having a core substrate with organic insulation layer on a core substrate; stacking the conductive foil and the board, wherein the passive component is embedded in the organic insulation layer and patterning on the conductive foil.
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申请公布号 |
US7523551(B2) |
申请公布日期 |
2009.04.28 |
申请号 |
US20050182743 |
申请日期 |
2005.07.18 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HORNG CHING-FU;WANG YUNG-HUI |
分类号 |
H01R43/00;H05K3/46 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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