Chip-scale package,申请号US20060405801-传众专利搜索

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发明名称	Chip-scale package
摘要	A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
申请公布号	US7524701(B2)	申请公布日期	2009.04.28
申请号	US20060405801	申请日期	2006.04.18
申请人	INTERNATIONAL RECTIFIER CORPORATION	发明人	STANDING MARTIN;CLARKE ROBERT J
分类号	H01L21/00	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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