发明名称 Pick-and-place cap for socket assembly
摘要 Disclosed is a socket assembly for electrically engaging an Integrated Circuit (IC) package with a printed circuit board. The socket assembly includes a socket body and a Pick-and-Place (PnP) cap. The socket body is mounted on the printed circuit board. Further, the PnP cap is capable of detachably mounting on the socket body. An upper surface of the PnP cap includes a raised portion with multiple chamfered portions projecting out from the raised portion. The multiple chamfered portions enable easier detachment of the PnP cap from the socket body.
申请公布号 US7524199(B2) 申请公布日期 2009.04.28
申请号 US20070863857 申请日期 2007.09.28
申请人 INTEL CORPORATION 发明人 ZHENG TIEYU;MA XIAOQING
分类号 H01R13/44 主分类号 H01R13/44
代理机构 代理人
主权项
地址