发明名称 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
摘要 Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.
申请公布号 US7524563(B2) 申请公布日期 2009.04.28
申请号 US20060401870 申请日期 2006.04.12
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 NAKANISHI TORU;KONDO KAZUNORI;HOSHIDA SHIGEHIRO;AMANO TADASHI
分类号 B32B27/38;B32B37/12;C08L63/00;C09J163/00 主分类号 B32B27/38
代理机构 代理人
主权项
地址