METHOD FOR REMOVING PLATE CONDUCTOR LAYER TO SEMI-ADDITIVE PROCESS

摘要

A plating conductive layer removing method in a semi-additive process is provided to reduce the environmental contamination by minimizing the use of chemicals. A plating conductive layer removing method in a semi-additive process comprises: a step of authorizing the electricity of an anode in an electronic circuit board(110); a step of authorizing the electricity a metal plate(150) after electrically connecting in cathode; and a step of removing a plating conductive layer of the electronic circuit board by melting a metallic atom of the plating conductive layer of the electronic circuit board inside the solution by the electrolysis reaction. The solution used for the electrolysis contains polypropylene glycol or polyethylene.