发明名称 Wiring substrate, electro-optic device, electric apparatus, method of manufacturing wiring substrate, method of manufacturing electro-optic device, and method of manufacturing electric apparatus
摘要 A wiring substrate includes a substrate, a first film, and a second film formed between the substrate and the first film, and an empty space is formed between at least a part of the second film and the substrate.
申请公布号 US7524734(B2) 申请公布日期 2009.04.28
申请号 US20060423066 申请日期 2006.06.08
申请人 SEIKO EPSON CORPORATION 发明人 YUDASAKA ICHIO
分类号 H01L21/76;H01L21/4763 主分类号 H01L21/76
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