| 摘要 |
A silicon microphone package and a manufacturing method thereof are provided to reduce the size of the silicon microphone package by equipping the passive circuit part inside. A silicon microphone package comprises a substrate(100), a silicon microphone(110), an active circuit(120), a case, and a touch pad(170). The passive circuit part consisting of passive devices is built in the substrate. The negative pressure tube through-hole(180) in which the external sound pressure is induced is formed in the substrate. The silicon microphone is welded so that the vibration plate vibrated by the outside sound pressure faces with the substrate. The active circuit part is welded on the substrate and converts the vibratory signal of the silicon microphone into the electric signal. The case is formed along the outer ring of substrate. The passive circuit part is made of a resistance(161) and a capacitor(164). |
