发明名称 Submount for light emitting diode and its manufacturing method
摘要 A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.
申请公布号 US7525124(B2) 申请公布日期 2009.04.28
申请号 US20050221817 申请日期 2005.09.09
申请人 HITACHI KYOWA ENGINEERING CO., LTD.;TOYODA GOSEI CO., LTD. 发明人 TAKEMORI HIDEAKI;HIGASHIYAMA SATOSHI;MORI KENJI;TOHMON RYOICHI;HIROSE MINORU;KAWAGUCHI HIROAKI
分类号 H01L27/15;H01L33/46;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L27/15
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