MULTI CHIP PACKAGE DEVICE TEST METHOD IN SEMICONDUCTOR DEVICE TEST SYSTEM

摘要

An MCP(Multi Chip Package) device test method of a semiconductor device test system is provided to test the MCP device with two dies or more with different functions in one package. A first die(310) equipped in the different MCP is connected to two sub sites(270-1,270-2) equipped in a first test site(200-1). A second die(320) equipped in the different MCP is connected to two sub sides equipped in two test sites(200-2). When the test site is connected to each die of the MCP, the test of all dies is performed at the same time. When the number of the sub site belonging to one test site is smaller than the number of the dies equipped in one MCP, all sub sites belonging to two test sites or more are connected to the die charging the same function of the different MCP.