HIGH-FREQUENCY MODULE AND METHOD OF MANUFACTURE THEREOF

摘要

The present invention aims to provide a miniaturized high-frequency module. To achieve the aim, the present invention is designed to contain an integrated circuit (24) and chip capacitors (23a, 23b) electrically connected therewith within a recess (22) in a substrate and to make a crystal oscillator (27) and the substrate (21) virtually equal in size. Thereby, a miniaturized high-frequency module can be obtained.