Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method

摘要

A preferred embodiment microcavity plasma device array includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis. A second electrode is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode is in a second layer, and in other embodiments the second electrode is also within the first metal oxide layer. A containing layer seals the discharge medium (plasma) into the microcavities. The electrodes form in a closed circumference around each microcavity in a plane transverse to the microcavity axis, and can be electrically isolated or connected.