POWER SEMICONDUCTOR MODULE WITH MULTI LAYER

摘要

A power semiconductor module is provided to improve workability and reliability by installing a power board, a drive board, and a control board in one frame in a multi layer structure. A partition(111) is formed in a middle part of a frame(110). A first space(113) and a second space(115) are formed in the inner side of the frame. A plurality of penetration holes are perpendicularly formed in the partition of the frame. A bridge pin(121) of the reverse Y shape is inserted into each penetration hole. The plurality of penetration holes are perpendicularly formed in the frame forming the second space. The bridge pin(123) with an L shape is inserted into each penetration hole. A power board(130) is installed in the first space formed by the frame and the partition. A drive board(150) is installed in the second space formed by the frame and the partition. The first space has the same size as the power board. The second space has the same size as the drive board.