| 摘要 |
A substrate treating device is provided to maintain a flow rate of a chemical solution provided in a substrate treating part to a value corresponding to a target value by using a control part controlling a flow rate of a chemical solution cycle line and a flow meter. A chemical solution supply device(10) includes a pump, a filter, and a heater, manufactures a chemical solution by mixing chemical groups, heats a chemical solution into a fixed temperature, and filters a heated chemical solution. The chemical solution is provided to substrate treating parts(60a,60b,60c,60d) through a chemical solution supply line(11), a supply line pipe part(30), and a nozzle pipe part(40). The supply line pipe part branches the chemical solution supply line as the number of substrate treating parts. The substrate treating parts are connected to branched lines. A part of the chemical solution is recovered to the chemical solution supply device through a cycle line pipe part(50) and the chemical solution cycle line. A flow meter(20) is installed in the chemical solution supply line, and senses a flow rate of the chemical solution inside the chemical solution supply line. A control part(70) reads pressure of the chemical solution through a flow rate control line(71), and controls an operation of a regulator(80) by comparing an input value of the read chemical solution with a predetermined target value.
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