| 摘要 |
Provided is a MEMS microphone package (100) that can shield a MEMS microphone chip (10) from noise to greatly improve sound quality and reduce manufacturing costs, by inserting a PCB substrate (106) to which the MEMS microphone chip (10) is mounted into a metal case (102), and then by ground-connecting the metal case to a main board (200) using an assembly process including bending and clamping an end of the case. The MEMS microphone package (100) includes a tetragonal container-shaped metal case (102) having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a PCB substrate (106) to which a MEMS microphone chip (10) and an ASIC chip (20) are mounted, the PCB substrate (106) being inserted into the case (102), and a support configured to support the PCB substrate and define a space between the case and the PCB substrate. |
