A method for manufacturing a printed circuit board is provided to simplify a manufacturing process by removing smear without an additional desmear process. A substrate is prepared(S1). The substrate includes a conductive layer. The substrate is made of an insulating material. An auxiliary film is laminated in a surface of the substrate(S2). The auxiliary film absorbs the laser beam. A penetration hole is formed by a laser drill(S3). The penetration hole passes through the substrate and the auxiliary film. The auxiliary film is delaminated from the surface of the substrate(S4). The auxiliary film includes a carbon black. A bonding layer is interposed between the auxiliary film and the substrate.
