| 摘要 |
A surface mount type crystal oscillator comprises: a package body comprised of laminated ceramic including a flat central layer made up of a first layer and a second layer, and a first and a second frame layer; a crystal blank hermetically sealed in a first recess defined by the first layer and the first frame layer; an IC chip placed in a second recess defined by the central layer and second frame layer; and a shield electrode disposed on a laminated surface of the second layer with the first layer. First and second electrode through-holes are formed through the first layer and second layer, respectively, for electrically connecting the crystal blank to the IC chip. The first and second electrode through-holes are positioned in areas outside the mounting position of the IC chip on the second recess.
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