发明名称 Semiconductor substrate for photosensitive chip
摘要 A circuit layout for a photosensitive chip includes a semiconductor substrate, a plurality of first circuit lines and a plurality of second circuit lines. The semiconductor substrate has a matrix of photosensitive units. Each photosensitive unit has a first blocking region, a second blocking region and a photosensitive region formed on the semiconductor substrate. The first blocking region is formed between neighboring photosensitive regions aligned in a vertical direction. The second blocking region is formed between neighboring photosensitive regions aligned in a horizontal direction. Free electrons produced by illuminating the photosensitive units are blocked by the first and the second blocking regions.
申请公布号 US7523432(B2) 申请公布日期 2009.04.21
申请号 US20070936800 申请日期 2007.11.08
申请人 SUNPLUS TECHNOLOGY CO., LTD. 发明人 VAN BLERKOM DANIEL;YANG MENG-CHANG
分类号 G06F17/50;G06F9/45;G06F9/455;H01L21/70;H01L27/146 主分类号 G06F17/50
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