发明名称 |
Chip stack package and manufacturing method thereof |
摘要 |
A chip stack package may include a package substrate, a plurality of semiconductor chips mounted on the package substrate, bonding wires electrically connecting the semiconductor chips to the package substrate, and spacers interposed between the adjacent semiconductor chips. Each of the spacers may include a plurality of metal bumps. The spacers may be higher than the highest point of the bonding wire from the active surface of the semiconductor chip.
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申请公布号 |
US7521810(B2) |
申请公布日期 |
2009.04.21 |
申请号 |
US20060502427 |
申请日期 |
2006.08.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG IN-KU;KIM PYOUNG-WAN |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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