| 摘要 |
<p>An electronic fabric and a manufacturing method thereof are provided to prevent a defect and a circuit breakdown due to disconnection by designing the circuit freely regardless of bending or folding. The electronic fabric includes a rear layer(100), a surface layer(200) and a pad layer. The rear layer includes a circuit with an electrical characteristic. The surface layer is electrically connected with the circuit of the rear layer. The rear layer or the surface layer includes base layers(110,210) and conductive layers(130,230). The base layer is made of synthetic fiber, regenerated fiber or natural fiber. The conductive layer is formed on the base layer. The conductive layer forms the electrical pattern. Insulating layers(140,240) are formed in the upper part of the rear layer, the surface layer or the conductive layer of the surface layer and the rear layer. The pad layer is formed in the upper part of the surface layer.</p> |
