THERMOCURABLE POLYIMIDE RESIN COMPOSITION

摘要

Disclosed is a thermocurable polyimide resin composition which can be formed into an adhesive layer for a metal-clad laminate only by removing a solvent without the need of employing a step of imidization at 300°C or higher, which is thermally curable, and which can be cured into an article having excellent adhesion properties, a low water absorption rate and good heat resistance. Specifically, disclosed is a thermocurable polyimide resin composition comprising a polyimide resin having a repeating unit represented by a specific structure and a compound having two or more polymerizable double bonds in the molecule. Further disclosed is a film comprising the thermocurable polyimide resin composition.Still further disclosed is a metal-clad laminate having an adhesive layer comprising the thermocurable polyimide resin composition.