发明名称 |
Semiconductor device having first and second dummy wirings varying in sizes/coverage ratios around a plug connecting part |
摘要 |
A semiconductor device, has a semiconductor substrate; a first insulating film which is disposed above the semiconductor substrate; a second insulating film which is disposed above the first insulating film; a wiring which is disposed in the first insulating film and has a plug connecting part; a plug which is disposed in the second insulating film and connected to the plug connecting part; a plurality of first dummy wirings which are disposed in a first area near the plug connecting part in the first insulating film; and a plurality of second dummy wirings which are disposed in a second area near the wiring excepting the plug connecting part in the first insulating film, and have at least either a width smaller than that of the first dummy wirings or a pattern coverage ratio larger than that of the first dummy wirings.
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申请公布号 |
US7521803(B2) |
申请公布日期 |
2009.04.21 |
申请号 |
US20060583698 |
申请日期 |
2006.10.20 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MORITA TOSHIYUKI;NISHIOKA TAKESHI |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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