发明名称 |
Low temperature bumping process |
摘要 |
A method for low temperature bumping is disclosed. A resin capable of being cross-linked by free-radical or cationic polymerization at low temperature is provided. Electrically conductive particles are then added to the resin to form a mixture. The mixture is then activated by heat or exposure to light to polymerize the mixture. In an alternative embodiment, a vinyl ether resin is used, to which electrically conductive particles are added. The mixture is polymerized by exposure to light.
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申请公布号 |
US7521115(B2) |
申请公布日期 |
2009.04.21 |
申请号 |
US20020321060 |
申请日期 |
2002.12.17 |
申请人 |
INTEL CORPORATION |
发明人 |
STERRETT TERRY LEE;CHEN TIAN AN;JAYARAMAN SAIKUMAR |
分类号 |
B32B9/00;B29C39/02;B29C70/58;B29C70/88;C08J5/10;C08L101/12;H01L23/485;H05K3/32 |
主分类号 |
B32B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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