| 发明名称 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
| 摘要 |
A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a predetermined interval and mechanically coupling the wiring substrate and the TFT with a adhesive and a step of electrically coupling the wiring substrate and the TFT by growing a bump from the electrode pad of the wiring substrate and/or the electrode pad of the TFT. |
| 申请公布号 |
US7521797(B2) |
申请公布日期 |
2009.04.21 |
| 申请号 |
US20050074351 |
申请日期 |
2005.03.07 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
YODA TSUYOSHI;AKAGAWA SUGURU |
| 分类号 |
H01L23/48;H01L51/50;G02F1/1368;G09F9/00;G09F9/35;H01L21/00;H01L21/336;H01L21/60;H01L27/12;H01L27/32;H01L29/00;H01L29/786;H01L51/52;H01L51/56;H05B33/02;H05B33/14 |
主分类号 |
H01L23/48 |
| 代理机构 |
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