SEMICONDUCTOR PACAKGE AND ELECTRONIC DEVICE HAVING THE SAME

摘要

A semiconductor package and an electronic device including the same are provided to improve reliability of a semiconductor package by minimizing a disconnection phenomenon and a crack of a wiring due to a thermal or mechanical stress. A semiconductor package(100) includes a semiconductor chip(110) and a molding film(120). The semiconductor chip and the molding film have a quadrangle plane structure. The semiconductor chip includes a plurality of die pads(130). The semiconductor package includes a plurality of out terminals(140) connected to the die pads. The die pads are arranged on four surfaces or two surfaces of the semiconductor chip. The out terminals are arranged around the semiconductor chip. A wiring(150) is extended from the die pad to the out terminal, and is overlapped with an interface(160) between the semiconductor chip and the molding film. A part(170) overlapped with the interface has a wider width than a different part.