发明名称 SUBSTRATE TRANSFER APPARATUS
摘要 A wafer transfer apparatus is provided to minimize deflection of a substrate by expanding a substrate support surface when transferring a substrate. A substrate is placed in a housing(11). A side roller(15) is installed in a lateral side of the housing. The side roller transfers the substrate placed in the housing. The housing is filled with the water and the air supplied through an air supply line(13) and a water supply line(14). A nozzle hole(12) or porous filter is formed in an upper part of the housing. The bottom of the substrate is supported by the water and the air sprayed through the nozzle hole or porous filter. The upper part of the side roller is protruded than the upper part of the housing. The nozzle hole is inclined to the moving direction of the substrate.
申请公布号 KR20090038332(A) 申请公布日期 2009.04.20
申请号 KR20070103763 申请日期 2007.10.15
申请人 EM-POWER CO., LTD. 发明人 LIM, JOUNG HYEON;MOON, DONG JIN;SEO, JAE HEE
分类号 H05K13/02 主分类号 H05K13/02
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