| 摘要 |
An apparatus for a polishing wafer bevel portion and a method for detecting an end point are provided to detect an end time of the polishing by reliving the load of a calculation process. A wafer polishing apparatus comprises a grinding tape(94), a polishing head(70), and a color image sensor(80). A wafer polishing apparatus comprises a controller, and the grinding tape has the penetrating power of a color image. The grinding tape is made of one of an alumina group, diamond, silica, ceria, silicon carbide. The grinding tape is guided with guide rollers(90,91). A polishing head supports a pusher pad which is faced with the polished surface of the wafer(2) and supports the grinding tape(94). The pusher pad is received into an accommodation space inside the polishing head, and the polishing head is connected to the pushing load(60). The pushing load is coupled with a piston shaft inside a cylinder(50) and the pushing load.
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