| 摘要 |
A test device is provided to increase the reliability of a high temperate test by heating a probe of a probe card which is separated from a wafer chuck partly. A wafer chuck(4) comprises a wafer chuck main body(41) including a thermostat(40), a partition member(42), a heating assembly(43), and a substrate(44). The wafer chuck is fixed on the XY table through a substrate, and 4 protrusions(42A) are radially arranged as the peripheral direction of the wafer chuck. A heating assembly arranged in protrusion is a right-angled triangle and an isosceles triangle. The probe(7A1) of the probe card separated out from the wafer chuck main body is exposed by the space from wafer. The heating assembly is parallelly arranged to the probe separated from the wafer chuck main body, and is heated by a heating member.
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