| 摘要 |
A bonding apparatus of an anisotropic conductive sheet is provided to bond an ITO(Indium Tin Oxide) electrode and a flexible printed circuit board for a short time by using the ultrasonic vibration regardless of the kind of the material of a screen panel. An oscillator having ultrasound oscillation capacity of 400W and an ultrasonic oscillator having the frequency of 40KHz are connected to one end of a tool horn(101) through a cable. The ultrasonic oscillator delivers the ultrasound vibration to the tool horn. The other end of the tool horn delivers vibration and pressure to a product(504) through a pad. A position controlling device(200) is attached to the tool horn. A servo motor(301) and a linear module controls the contact quantity between the product and a ultrasound welder including the tool horn. The pad is contacted with one side of the tool horn.
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