| 摘要 |
A method for manufacturing a semiconductor package is provided to emit the heat generated from the semiconductor chip by plating Au instead of Ag in the bottom surface of the semiconductor. Ti and the Ni which is the base layer(300) in the bottom surface of the semiconductor chip(100) are plated on the back side of the wafer. The solder(400) is plated in the bottom surface of the lead(200). At the same time, the solder for the ground is plated in the Ni surface of the base layer. Ti and the Ni are plated in the base layer of wafer and the sawing process is carried out. The semiconductor chip, the wire and lead are molded with resin. The bottom surface of the semiconductor chip and the bottom surface of the lead are molded to be exposed.
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