| 摘要 |
The production of an electronic micromodule having an integrated circuit and an antenna coil electrically connected to the circuit, comprises making an integrated circuit and cylindrical contact pad of the circuit on a semiconductor plate material, making a coil winding conductor and the contact pad of the coil on the another plate, assembling the plates one against the other while contacting the coil pad with the integrated circuit pad, and forming an openings that crosses the first and second face of the second plate on which the winding conductor is formed. The production of an electronic micromodule having an integrated circuit and an antenna coil electrically connected to the integrated circuit, comprises making an integrated circuit and cylindrical contact pad of the circuit on a semiconductor plate material, making a coil winding conductor and the contact pad of the coil on the another plate, assembling the plates one against the other while contacting the coil pad with the integrated circuit pad, forming an openings crossing the first and second face of the second plate on which the winding conductor is formed, filling the openings with a conductor material to obtain an electrical conductor that connects the winding conductor at the contact pad of the coil, forming a groove on the second plate in the form of coil, filling the groove with an electrical conductor material to obtain the coil winding conductor, forming the pads (6A, 6B) in an electrical conductor material on the contact pad of the coil and the integrated circuit so that the electrical contact between the coil and the integrated circuit is established by the pads followed by the assembly of the plates, treating the pads by fusing, bonding or joining, and depositing a polymeric material on the first/second plate (10) to assemble the plates. The integrated circuit and the contact pad of the circuit are formed on the first face of the first plate (1). The conductor coil is formed on the first face of the second plate. The formation of the opening comprises forming blind holes on the first face of the second plate, and thinning the second plate so that the blind holes open to the second face of the second plate. The pads are made up of a material comprising metals, composition of metals, eutectic alloy and non-eutectic hard alloy. Independent claims are included for the following: (1) the production of collective micromodules; and (2) a micromodule. |
