Assembly with a module and a module rack

摘要

The arrangement has an assembly provided with a housing encapsulation and mounted on a mounting rack. A contacting device is arranged on the assembly and thermally connected to the contacting device of the mounting rack. A heating element is arranged on the assembly that increases temperature in the housing encapsulation. An evaluation unit is arranged on the assembly that checks a heat conduction between the contacting device and the contacting device based on a thermal energy supplied by the heating element and the increase of temperature.