发明名称 |
METHODS AND APPARATUS FOR INTEGRATED CIRCUIT HAVING MULTIPLE DIES WITH AT LEAST ONE ON CHIP CAPACITOR |
摘要 |
An integrated circuit comprises a plurality of layers including a first substrate with an on chip capacitor and a second substrate. In one embodiment, the second substrate has an on chip capacitor. The first and/or second substrate can include a sensor element, such as a magnetic sensor element. |
申请公布号 |
KR20090034802(A) |
申请公布日期 |
2009.04.08 |
申请号 |
KR20087027313 |
申请日期 |
2007.04.10 |
申请人 |
ALLEGRO MICROSYSTEMS, INC. |
发明人 |
TAYLOR WILLIAM P.;VIG RAVI |
分类号 |
H01L27/22;G01R33/07 |
主分类号 |
H01L27/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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