发明名称 METHODS AND APPARATUS FOR INTEGRATED CIRCUIT HAVING MULTIPLE DIES WITH AT LEAST ONE ON CHIP CAPACITOR
摘要 An integrated circuit comprises a plurality of layers including a first substrate with an on chip capacitor and a second substrate. In one embodiment, the second substrate has an on chip capacitor. The first and/or second substrate can include a sensor element, such as a magnetic sensor element.
申请公布号 KR20090034802(A) 申请公布日期 2009.04.08
申请号 KR20087027313 申请日期 2007.04.10
申请人 ALLEGRO MICROSYSTEMS, INC. 发明人 TAYLOR WILLIAM P.;VIG RAVI
分类号 H01L27/22;G01R33/07 主分类号 H01L27/22
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