发明名称 |
Fin-FET having GAA structure and methods of fabricating the same |
摘要 |
Example embodiments of the present invention relate to a semiconductor device and methods of fabricating the same. Other example embodiments of the present invention relate to a fin-field effect transistor (Fin-FET) having a fin-type channel region and methods of fabricating the same. A Fin-FET having a gate all around (GAA) structure that may use an entire area around a fin as a channel region is provided. The Fin-FET having the GAA structure includes a semiconductor substrate having a body, a pair of support pillars and a fin. The pair of support pillars may protrude from the body. A fin may be spaced apart from the body and may have ends connected to and supported by the pair of support pillars. A gate electrode may surround at least a portion of the fin of the semiconductor substrate. The gate electrode may be insulated from the semiconductor substrate. A gate insulation layer may be interposed between the gate electrode and the fin of the semiconductor substrate.
|
申请公布号 |
US7514325(B2) |
申请公布日期 |
2009.04.07 |
申请号 |
US20060505936 |
申请日期 |
2006.08.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SUK-PIL;HYUN JAE-WOONG;PARK YOON-DONG;KIM WON-JOO;PARK DONG-GUN;LEE CHOONG-HO |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|