发明名称 |
Aligning stacked chips using resistance assistance |
摘要 |
The present invention relates to a method of aligning stacked chips wherein the apparatus and method utilize bumps in the form of exposed metal lines on a first chip. The present invention further relates to taking a resistance measurement to determine a quality of alignment wherein the resistance measurement indicates a direction in which the first chip and the second chip are misaligned. |
申请公布号 |
US7514276(B1) |
申请公布日期 |
2009.04.07 |
申请号 |
US20080190395 |
申请日期 |
2008.08.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YEAROUS COREY ELIZABETH;PAONE PHIL CHRISTOPHER;WILLIAMS KELLY LYNN;PAULSEN DAVID PAUL;UHLMANN GREGORY JOHN;SHEETS, II JOHN EDWARD;ERICSON KARL ROBERT |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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