发明名称 High pressure processing method and apparatus
摘要 Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.
申请公布号 US7513265(B2) 申请公布日期 2009.04.07
申请号 US20030688889 申请日期 2003.10.21
申请人 KABUSHIKI KAISHA KOBE SEIKO SHO;DAINIPPON SCREEN MFG. CO., LTD. 发明人 YOSHIKAWA TETSUYA;INOUE YOICHI;WATANABE KATSUMI;MASUDA KAORU;IIJIMA KATSUYUKI;IWATA TOMOMI;MURAOKA YUSUKE;SAITO KIMITSUGU;MIZOBATA IKUO
分类号 B08B6/00;B08B7/00;C25F1/00;G03F7/00;H01L21/00;H01L21/302;H01L21/304 主分类号 B08B6/00
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