发明名称 Two dimensional magnetron scanning for flat panel sputtering
摘要 A generally rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100 mm for a 2 m target. The scan may follow a double-Z pattern along two links parallel to a target side and the two connecting diagonals. The magnetron includes a closed plasma loop formed in a convolute shape, for example, serpentine or rectangularized helix with an inner pole of nearly constant width extending along a single path and having one magnetic polarity completely surrounded by an outer pole having the opposed polarity.
申请公布号 US7513982(B2) 申请公布日期 2009.04.07
申请号 US20040863152 申请日期 2004.06.07
申请人 APPLIED MATERIALS, INC. 发明人 TEPMAN AVI
分类号 C23C14/00;C23C14/32;C23C14/34;C23C14/35;C25B9/00;C25B11/00;C25B13/00;H01J37/34 主分类号 C23C14/00
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