| 摘要 |
A method and apparatus of cleaning a substrate can spray shock wave to the substrate and efficiently leave out the foreign material remaining in the substrate. The substrate is supported(S100). The laser beam is irradiated to the top of the supported substrate(S200). The irradiated laser beam is focused and the preliminary-shock wave is generated(S300). The preliminary-shock wave is focused in the reaction space to form the impulse wave(S400). At this time, the gas can be supplied to the reaction space. The impulse wave is emitted to the substrate direction and the foreign material remaining in the substrate is leave out(S500). The laser beam can be induced to the reaction space.
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