| 摘要 |
An improved chip module is described. The improved chip is comprised of a loading board for connecting with an external electronic component, a plurality of electrical conductors electrically disposed on the loading board. Each electrical conductor has an elastic body and a metal layer disposed thereon. The chip module connects with the external PCB directly. The electrical connector does not need to be disposed between the chip module and the external PCB, thereby reducing the manufacturing cost of the chip module.
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