| 摘要 |
A method for manufacturing a semiconductor device includes preparing a wiring board including a base board having a first surface and a second surface, a wiring pattern having a plurality of electrical connectors and formed on the first surface, a first resist layer having a first opening for exposing the electrical connectors and partially covering the first surface and the wiring pattern, and a second resist layer having a second opening that overlaps with a region where the electrical connectors are formed and partially covering the second surface; preparing a semiconductor chip having a plurality of electrodes; and performing a bonding operation for electrically coupling the plurality of electrical connectors and the plurality of electrodes correspondingly by holding and heating the semiconductor chip with a bonding tool that has a heating mechanism and an end face whose contour is smaller than that of the second opening, aligning the bonding tool in such a way that the end face only overlaps with a region inside the second opening on the second surface, and mounting the semiconductor chip on the first surface of the wiring board.
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