发明名称 |
Stacked structures and methods of fabricating stacked structures |
摘要 |
A stacked structure includes a first die coupled to a first substrate and having a first conductive structure formed through the first die. A second die is mounted over the first die. The second die is coupled to the first substrate by the first conductive structure. At least one first support structure formed from a second substrate is provided over the first substrate, adjacent to at least one of the first die and the second die. A top surface of the first support structure is substantially coplanar with a top surface of at least one of the first and second dies adjacent to the first support structure. The stacked structure further includes a heat spreader mounted over the second die.
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申请公布号 |
US7514775(B2) |
申请公布日期 |
2009.04.07 |
申请号 |
US20060539814 |
申请日期 |
2006.10.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHAO CLINTON;YUAN TSORNG-DIH;PAN HSIN-YU;CHEN KIM;PENG MARK SHANE;KARTA TJANDRA WINATA |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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