INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME

摘要

A curable resin composition is provided to be suitable for resist ink for a white printed circuit board applying light reflection, crack resistance and yellowing resistance. A curable resin composition comprises (i) curable resin of 100.0 parts by weight, (ii) inorganic filler of 10-1200 parts by weight, and (iii) organic filler having elastic modulus of 1-2000 (MPa) and the average particle diameter of 0.01-10 micron. The content weight ratio of the component (II) to (III) is 1-41. The component (II) is white pigment and/or a material having thermal conductivity of 1.0-500 (W/m.K).