STACK-TYPE SEMICONDOCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

摘要

A stack-type semiconductor package, method of forming the same and electronic system including the same are provided to improve the degree of integration by connecting the lower part chip package and top chip package electrically through both sides adhesion wiring board. The lower printed circuit board(100) comprises a plurality of wirings(100a) and plurality of bump(100b) for the bonds. One or a plurality of first underlying chips(105) is laminated successively on the lower printed circuit board. First underlying chips are electrically connected with a plurality of wirings. The first underlying chips is covered with the lower shaping resin compound(108). The top chip package(115) is adhered at both sides adhesion wiring board.